| abstract |
In one embodiment, a semiconductor package includes a clip frame having a first clip with a first support structure, a first stem, and a first contact portion disposed on a front side of the semiconductor package. The first support structure is adjacent to an opposite backside of the semiconductor package. The first rod connects the first contact portion with the first support structure. A first wafer is disposed on the first support structure of the first clamp. The first wafer has first contact pads on the front side of the semiconductor package. An encapsulant material surrounds the first wafer and the first clip. |