| abstract |
The invention relates to a carrier (such as a lead frame) and to a clip for at least one semiconductor element which has at least one functional surface (10) for connection to the semiconductor element and a plurality of connections (11). The invention is characterized in that the material of the carrier or of the clip comprises a metal and a layer (12) made of a solidified (dried) sintering paste, in particular a sintering paste containing silver and/or a silver compound, and is arranged on the functional surface (10), wherein the carrier or clip and the layer (12) made of sintering paste form an intermediate product which can be connected to the semiconductor element. The carrier and the clip are used to produce a packaging having a lead frame (lead frame package) by connection to the chip by means of sintering of the solidified sintering pastes in one work step. |