| abstract |
The semiconductor device of the present invention includes: a semiconductor wafer; an electrode pad including an aluminum-containing metal material formed on the surface of the semiconductor wafer; an electrode lead disposed around the semiconductor wafer; and a wiring including a linear extension A body part, and a pad bonding part and a wire bonding part which are formed at both ends of the body part and are respectively bonded to the electrode pad and the electrode; and a resin package which seals the semiconductor wafer, the electrode lead, and The above-mentioned wiring; and the above-mentioned wiring includes copper; the entire electrode pad and the entire pad joint portion are integrally covered with a water-impermeable film. |