| abstract |
The present invention provides a resin composition having excellent coating workability while imparting reliability, including resistance to solder reflow, to a semiconductor device when used as a die attachment material or an adhesive for a heat-radiating member. This resin composition contains: a polymer or a copolymer of a conjugated diene compound having at least one functional group; a thermosetting resin; and a (meth)acrylic polymer or copolymer having a reactive functional group capable of reacting with other reactive groups. |