| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate |
1997-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1999-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
1999-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2941754-B2 |
| titleOfInvention |
Circuit board adhesive suitable for soldering environment |
| priorityDate |
1997-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |