| abstract |
ThenThe invention relates to a semiconductor device (1) with a semiconductor chipn(3) in leadframe technique and a method of manufacturingnthereof. For this purpose, the semiconductor chip (3) on a chip pad (4) of anchip carriern(8) fixed, wherein on the chip pad (4) has a metallic buffer layern(5) is arranged. On the metallic buffer layer (5) is anCover layer (6) arranged cohesively with the back of thenSemiconductor chips (3) is connected. |