| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_86108d8e843c02ae9c1f16f1cff9a5d9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4951
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49575
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49579
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4952 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-06 |
| filingDate |
2017-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59ca660d2f997798139f2d3cd6aed3ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c11a2df738cacc3a00a84ebf33fcae8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8969860737e1a3fabddc2a0899dccc39 |
| publicationDate |
2018-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201833269-A |
| titleOfInvention |
Square flat leadless package semiconductor package, method of manufacturing the same, and mask for manufacturing flat rectangular leadless package semiconductor package |
| abstract |
The invention relates to a square flat no-lead package semiconductor package, a manufacturing method thereof, and a mask sheet for manufacturing a square flat no-lead package semiconductor package, which achieves excellent die bonding and metal wire bonding, and can effectively suppress the same. The leakage of the sealing resin can improve the reliability of the above-mentioned square flat leadless packaged semiconductor package and the productivity and efficiency in the manufacturing process. The square flat leadless packaged semiconductor package of the present invention is characterized by The lamination process of the mask embossing the lead frame is manufactured by forming a contact depth in the adhesive layer of the mask. |
| priorityDate |
2017-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |