| abstract |
A semiconductor chip is attached to a lead frame with a filmynorganic die-bonding material having a water absorption of 1.5% bynvolume or less; having a saturation moisture absorption of 1.0% bynvolume or less, having a residual volatile component in an amount notnmore than 3.0% by weight, having a modulus of elasticity of 10 MPa ornless at a temperature of 250 °C. The semiconductor device thusnobtained can be free from occurrence of reflow cracks during reflownsoldering for the packaging of semiconductor devices. |