| abstract |
Filler particle (A), thermosetting resin (B), and following formula (1):n n n -(S) n- (1)n n n (In formula (1), n is an integer of 1 or more.)n n n Compound (C) having a sulfide bond represented byn n n As a compound (C1) which has the said sulfide bond and an alkoxy silyl group, the content of the compound which has a disulfide bond among the compound (C1) which has the said sulfide bond and an alkoxy silyl group measured the said sulfide bond and the alkoxy silyl measured by high performance liquid chromatography. Compound (C1-1) which is 15% or more in the ratio of the peak area resulting from the compound which has the said disulfide bond with respect to the total peak area of the compound (C1) which has a group,n n n The compound (C2) having the sulfide bond and a hydroxyl group, andn n n Compound (C1) having the sulfide bond and the alkoxy silyl group and Compound (C2) having the sulfide bond and the hydroxyl groupn n n Adhesive composition for semiconductors any one of. |