| abstract |
(57) [Summary] (Modified) [PROBLEMS] A novel phenol derivative added to an adhesive used for electric and electronic parts such as a semiconductor package, particularly a surface coated with a metal such as copper, silver, and gold. An adhesive is provided that exhibits excellent adhesion to the layer. A phenolic compound of the general formula 11 and HS- The dithiol of R 2 -SH is heated and reacted to obtain a phenolic monothiol, which is oxidized with hydrogen peroxide in an ethanol solvent to obtain a phenolic disulfide of the general formula 21. [Wherein, R 1 represents a methylene chain having 2 or 3 carbon atoms, R 2 represents a methylene chain having 1 to 10 carbon atoms, and G represents a hydrogen atom or a substituent. ] |