| abstract |
A semiconductor chip is stuck to a lead frame with a film-like organic bonding agent having a coefficient of water absorption of below 1.5 vol. %, a coefficient of saturated moisture absorption of below 1.0 vol. %, a residual volatile component of below 3.0 wt.%, and a modulus of elasticity of below 10 MPa at 250 °C. Therefore, reflow cracks can be avoided when solder reflow is performed for mounting the semiconductor device. |