| abstract |
(57) [Abstract] [Purpose] To improve the crack resistance during surface mounting of semiconductor devices. In a semiconductor device in which a semiconductor element is fixed on a die pad via an adhesive layer, the semiconductor element is connected to a lead frame with a bonding wire, and these are sealed with a synthetic resin, the adhesive layer is A resin-encapsulated semiconductor device having a moisture absorption rate lower than that of a resin sealing the same, wherein the adhesive layer is a resin containing a thermoplastic resin having a low moisture absorption rate, or a glass cloth having a low moisture absorption rate, A base material such as a metal foil or carbon cloth impregnated with or coated with a resin can be used. [Effect] Moisture is unlikely to be accumulated at the interface between the die pad and the semiconductor element, and cracks do not occur even when heated during surface mounting. |