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filingDate 1992-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1cb5860c4d4a2a1fc2e82beba7cdd60
publicationDate 1993-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H05190022-A
titleOfInvention Insulating paste
abstract (57) [Summary] [Constitution] The present invention is characterized by comprising (A) a bisphenol-blocked urethane polymer and an oligomer (B) a polyhydric alcohol compound (C) an insulating filler as essential components. Sex paste. [Effect] Since this insulating paste uses urethane polymers and oligomers blocked with bisphenol as its components, when applied to the bonding of semiconductor chips, the warp deformation of large-sized chips is extremely small even after the heating of wire bonding. Adhesive strength has the required strength, and less moisture absorption.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7781896-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6717242-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6855579-B2
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priorityDate 1992-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 35.