| abstract |
A semiconductor flip-chip package (10) comprising a substrate (11) comprising a first main area, a second main area opposite the first main area and one or more conductive structures (11.1) which are arranged on the first main area, wherein one or a plurality of pillars (12) are arranged on at least one of the conductive structures (11), a semiconductor die (13) comprising one or more contact pads (13.1) on a main surface thereof, the semiconductor die (13) with the substrate (11) is connected, so that at least one of the contact pads (13.1) is connected to one of the columns (12), and an encapsulation means (14) which is arranged on the substrate (11) and the semiconductor die (13). |