| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fe950d708c7cd3395969c85dcbe67c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02M1-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02M7-5387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1305
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02M1-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49548
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H02M7-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49513 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate |
2014-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27fc944812a67df46c92fb80d63f4274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8bcf8893310f382ab18efd1b141be631
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ba57815e5804f2742d9cdafea290ea9 |
| publicationDate |
2014-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2775521-A2 |
| titleOfInvention |
Power Quad Flat No-Lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC) |
| abstract |
According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a multi-phase inverter situated on a leadframe. The PQFN package further includes drivers situated on the leadframe and configured to drive the multi-phase inverter. The PQFN package also includes bootstrap diodes respectively coupled to the drivers. The bootstrap diodes are in a common integrated circuit (IC) that is situated on the leadframe. The common IC can include the drivers. The drivers can be high side drivers that are coupled to high side power switches of the multi-phase inverter. Also, the bootstrap diodes can be coupled to a supply voltage terminal of the PQFN package. Furthermore, the PQFN package can include wirebonds coupling the common IC to bootstrap supply voltage terminals of the PQFN package. |
| priorityDate |
2013-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |