| abstract |
A waterproof electronic device includes: an electronic component module comprising an electronic component including a semiconductor element, a heat dissipation member provided on the electronic component in a thermally conductive manner, and an insulating material surrounding the electronic component such that a Surface of the heat dissipation element is exposed, has; and a waterproof film formed on at least portions of the module of electronic components to be immersed in a coolant on entire surfaces. |