abstract |
A conductive adhesive (8) for bonding semiconductor pellets (2) to tabs (1) is made from a conductive addition reaction-curing silicone rubber composition which contains ≦ 500 ppm of low-molecular-weight siloxane which has a vapor pressure ≧ 10 mmHg at 200°C. The conductive adhesive can contain a metal micropowder such as gold, silver, nickel or copper. |