| abstract |
This invention provides a semiconductor device lead frame comprising a mounting tab for a semiconductor chip located within the lead frame and multiple inner leads extending to the area adjacent to the perimeter of the tab. The configuration of the inner leads with respect to one another and the mounting tab is stabilized by adhering at least a portion of the leads and, optionally, the mounting tab to a dielectric film coated on one side with a cured, heat-activated silicone adhesive. |