| abstract |
A semiconductor device according to an embodiment is a semiconductor device in which a semiconductor chip mounted on a chip mounting portion is sealed with a resin, wherein a gap between an edge portion of the semiconductor chip along a first direction and an edge portion of the chip mounting portion is sealed with a resin. The first part is fixed on the chip mounting surface side between them. In addition, the first member is sealed with the resin. In addition, the length of the first portion of the chip mounting portion in the first direction is longer than the length of the semiconductor chip in the first direction in plan view. |