abstract |
A printed wiring board including solder pads excellentnin frequency characteristic is provided. To do so, each soldernpad 73 is formed by providing a single tin layer 74 on a conductorncircuit 158 or a via 160. Therefore, a signal propagation ratencan be increased, as compared with a printed wiring board ofnthe prior art on which two metal layers are formed. In addition,ndue to lack of nickel layers, manufacturing cost can be decreasednand electric characteristics can be enhanced. |