| abstract |
PROBLEM TO BE SOLVED: To provide a package structure and a method for manufacturing the same, which effectively improve the heat dissipation performance of the package structure. SOLUTION: A package structure 200a is arranged on a substrate 100 having a first surface S1 and a second surface S2 opposite to each other, a die 106 electrically connected to the substrate, and a first surface of the substrate. A sealant 110 for sealing the die, and at least one first conductive terminal 112 and at least one second conductive terminal 114. At least one first conductive terminal and at least one second conductive terminal are arranged on the second surface of the substrate. At least one second conductive terminal is electrically connected to the die via the substrate. At least one first conductive terminal is overlapped with the die in a direction perpendicular to the second surface of the substrate. The first area of at least one first conductive terminal is larger than the second area of at least one second conductive terminal. [Selection diagram] FIG. 8B |