| abstract |
A method of fabricating a semiconductor device including a semiconductor wafer, a substrate, and/or other semiconductor wafers, and an adhesive layer interposed therebetween. The method includes: sandwiching a laminate having a semiconductor wafer, a substrate, another semiconductor wafer or a semiconductor wafer, and an adhesive layer by a temporary pressing contact pressing member, thereby heating and pressurizing the substrate, and the like a step of temporarily pressing a semiconductor wafer or a semiconductor wafer on a semiconductor wafer; and holding the laminated body by a pressing member for a final pressure-bonding member prepared separately from the temporary pressure-bonding pressing member, thereby performing heating and pressurization This is the step of connecting the connection portion of the semiconductor wafer to the connection portion of the substrate or other semiconductor wafer. |