| abstract |
As a wiring board which connects the semiconductor element 10, The glass substrate which has the through-hole group 20d in which the some through-hole 20c from the input surface 20a to the output surface 20b was formed in predetermined | prescribed arrangement, and through The wiring board 20 made of the conductive member 21 formed on the inner wall of each of the through holes 20c included in the hole group 20d to electrically conduct between the input face 20a and the output face 20b. use. The bump electrode 12 of the semiconductor element 10 connected to the input surface 20a has a conductive portion 22 formed in a region covering the through hole group 20d, the conductive member 21, and the through hole group 20d. The bump electrode 12 is connected inside each of the plurality of through holes 20c. Thereby, the semiconductor device to which the corresponding electroconductive path in a semiconductor element and a wiring board are connected favorably, and the radiation detector using the same can be obtained. |