http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11340277-A

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filingDate 1998-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1999-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11340277-A
titleOfInvention Semiconductor chip mounting substrate, semiconductor device, and method of mounting semiconductor chip on semiconductor chip mounting substrate
abstract (57) [Summary] [PROBLEMS] To prevent a displacement that occurs when a semiconductor chip is mounted on a semiconductor chip mounting substrate. A substrate (4) is formed by laminating a pad (1) serving as an electrode on a substrate (4a), and further coating a solder resist (3) so that the surface of the pad (1) is exposed. The pad 1 is formed with a concave portion 8 having a tapered surface 8b having a tapered side surface and a positioning portion 8a having a bottom surface. On the chip 6, bumps 7 serving as electrodes of the chip 6 are formed via aluminum pads 5. The chip 6 is pressurized and pushed down, so that the bump 7 Slides on the tapered surface 8b and is positioned at the positioning portion 8a.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2738796-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007123545-A
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Total number of triples: 32.