| abstract |
An example of a package of superconducting qubit devices includes a qubit-die housing a superconducting qubit device comprising at least one resonator and a package substrate, each having a first surface and an opposite second surface. The resonator is arranged on the first surface of the qubit-die. The first surface of the qubit-die faces the second surface of the package substrate and is attached thereto by means of first-level connections. The second surface of the package substrate includes a superconductor facing at least portions of the resonator. Such a package architecture may advantageously allow for reducing design complexity and unwanted coupling, allow for inclusion of larger numbers of qubit devices in the package's qubit, reduce a potentially negative effect of the materials used in the package substrate on resonator performance, and some sources of qubit decoherence limit. |