Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-17181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05684 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06589 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06519 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05616 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06131 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05611 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16237 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05109 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05639 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05609 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05139 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05124 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4814 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3677 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-06 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-861 |
filingDate |
2013-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2014-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b28e34a9ad5c6786ef7d515fa54e521f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8e2659f0eb7a80426da00550dc30e7a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edd56c0f9f6ece05de768bffb5c1b7cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be8558f47bc49d1eb2d587756cb1b5dc |
publicationDate |
2014-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8779572-B2 |
titleOfInvention |
On-chip heat spreader |
abstract |
A three dimensional (3D) stacked chip structure with chips having on-chip heat spreader and method of forming are described. A 3D stacked chip structure comprises a first die having a first substrate with a dielectric layer formed on a front surface. One or more bonding pads and a heat spreader may be simultaneously formed in the dielectric layer. The first die is bonded with corresponding bond pads on a surface of a second die to form a stacked chip structure. Heat generated in the stacked chip structure may be diffused to the edges of the stacked chip structure through the heat spreader. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10366906-B2 |
priorityDate |
2009-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |