| abstract |
An embodiment of the present invention relates to a semiconductor device and a method of manufacturing the same. The technical problem to be solved is to reduce the thickness of the semiconductor device and to reduce the thickness of the plastic ball without laser ablation and / or an additional ball drop process. a proud ball structure, and a method of manufacturing the same. To this end, the invention comprises a semiconductor die, a conductive ball electrically connected to the semiconductor die, and a encapsulant covering the semiconductor die and the conductive ball, wherein the encapsulant comprises a semiconductor device comprising spaced- A manufacturing method is disclosed. |