| abstract |
A semiconductor device capable of suppressing the occurrence of cracks is provided. A semiconductor device includes a multilayer wiring board and a semiconductor chip mounted on the multilayer wiring board. The electrode pad 3 of the semiconductor chip 2 is composed of a first electrode pad 3a disposed in proximity to each corner of the back surface 2a of the semiconductor chip 2 and other second electrode pads 3b. The connection pads 5 on the multilayer wiring board 4 include a first connection pad 5a connected to the first electrode pad 3a via the bump 7, and a second connection pad connected to the second electrode pad 3b via the bump 7. 5b. The first connection pad 5a is supported by a first insulating region 41 made of a thermoplastic resin, and the second connection pad 5b is supported by a second insulating region 42 made of a thermosetting resin. . [Selection] Figure 1 |