| abstract |
The present invention relates to a flip-chip module having a semiconductor chip having a contact post, wherein the contact post is electrically and mechanically connected to the substrate. Between the substrate and the semiconductor chip, a spacer mechanically coupled to the substrate and / or the semiconductor chip is provided. By this means, the thermal stress of the flip-chip module is absorbed by the spacer and is not transmitted to the semiconductor chip.n n n The present invention also relates to a method of manufacturing a flip-chip module, wherein a spacer is first disposed between a semiconductor chip and a substrate, and then the contact post is soldered to the contact points of the substrate. The provision of the spacers accurately sets the spacing between the semiconductor chip and the substrate, thus improving the quality of the soldering points.n n n n Flip-chip, contact posts, spacers |