| abstract |
A semiconductor device is provided with: a semiconductor chip (1), which has an element forming surface having at least one element formed thereon and a plurality of electrode pads (2) formed on the element forming surface; a wiring board (10), which has the main surface thereof facing the element forming surface of the semiconductor chip (1), and has a plurality of connecting pads (15) which are formed at positions facing the electrode pads (2) formed on the main surface; and a plurality of solder bumps (4), which are provided between the electrode pads (2) and the connecting pads (15), and electrically connects the pads. In each of the solder bumps (4), the material of a UBM layer (3) formed on the side of the electrode pad (2) and that of a barrier metal layer (17) formed on the side of the connecting pad (15) have the same main composition. |