| abstract |
A semiconductor package and a manufacturing method thereof, the semiconductor package includes: a first semiconductor device having a first top surface and a first bottom surface opposite to each other; a plurality of conductive balls formed on the first top surface; Two semiconductor devices, which have opposite second top surfaces and second bottom surfaces, and the second bottom surface faces the first top surface; and a plurality of conductive pillars formed on the second bottom surface and respectively joined to the conductive pillars The through ball is used to electrically connect the first and second semiconductor devices, and the height of the conductive column is less than 300 microns. Thereby, the present invention can easily control the height of the semiconductor package and be used on a semiconductor package with finer pitch via balls. |