| abstract |
Structure that has: a die substrate (20); a passivation layer (22a) on the die substrate (20), a distal surface of the passivation layer (22a) being spaced from the die substrate (20); a first connection structure (24) on the passivation layer (22a), the first connection structure (24) having a first via portion (54) through the passivation layer (22a) to a first conductive feature of the die substrate (20), wherein the first connection structure (24) further comprises a first pad (58) and a first transition element (56) on the distal surface of the passivation layer (22a) between the first via section (54) and the first pad (58); a second connection structure (24) on the passivation layer (22a), the second connection structure (24) having a second via section (54) through the passivation layer (22a) to a second conductive feature of the die substrate (20), wherein the second connection structure (24) further comprises a second pad (58) and a second transition element (56) on the distal surface of the passivation layer (22a) between the second via section (54) and the second pad (58); a first electrical connector (32) on the first pad (58) and a second electrical connector (32) on the second pad (58); and at least one barrier (30) for aligning the first connection part on the first pad (58) and the second electrical connection part (32) on the second pad (58), the at least one barrier rising from the top of the passivation layer (22a) and is arranged between the first pad (58) and the second pad (58), wherein the at least one barrier (30) on the passivation layer (22a), at least one of the first connection structure (24) and the second connection structure (24) or a combination therefrom, the at least one barrier (30) not completely surrounding at least the first pad (58) or the second pad (58). |