| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b2169fe4fbee6926a491f81615f918e9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f224b21126c9f23eca45321edcf00a80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9e8bca34cb32878d8700ff66ae42609b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bcd47feabc20e75f1113da78708f261b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0126 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B82Y30-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-02 |
| filingDate |
2011-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c08564d3eb6ca02faa0c0c46f3e656ea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e945f0bc66b92c44293e9bfd0692257f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0d5d57bb29123cc0905587b13bb306c |
| publicationDate |
2012-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2012228013-A1 |
| titleOfInvention |
Defective conductive surface pad repair for microelectronic circuit cards |
| abstract |
An electrically conductive adhesive (ECA) for repairing electrically conductive pad and trace interconnects and a method of repairing interconnect locations. The method of repairing at least one defect within the area of electrically conductive circuitized substrate traces and pads outside of a pristine center area incorporates an ECA and a forming gas plasma. The ECA contains a mixture of components that allow the adhesive to be adapted to specific requirements. Curing the adhesive results in effective electrical connections being formed between the adhesive and the base pad so that the metallurgies of the conductors and of the ECA are effectively combined to engage and repair the conductor defect. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106904570-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9593264-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102014101030-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102014101030-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11296012-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022400557-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10347563-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9698079-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019099817-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015189759-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109093120-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104416296-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10881007-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110232987-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9399723-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110972406-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11647591-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112822839-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10994366-B2 |
| priorityDate |
2011-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |