| abstract |
An object of the present invention is to provide a wiring board that can suppress an increase in manufacturing cost and can handle fine wiring, a manufacturing method thereof, and a semiconductor package having the wiring board. The wiring board includes a plurality of laminated ceramic layers and internal wiring, and a ceramic board in which an electrode electrically connected to the internal wiring is exposed from one surface and a main surface are formed. A silicon substrate provided with a wiring layer including: a wiring pattern, and a via fill that is electrically connected to the wiring pattern at one end and exposed from the back surface at the other end that is located on the opposite side of the main surface; The back surface of the silicon substrate is anodically bonded to the one surface of the ceramic substrate, and the via fill of the silicon substrate is directly bonded to the electrode of the ceramic substrate. [Selection] Figure 4 |