| abstract |
The present invention provides a wiring board using an inorganic material that can easily reduce power source impedance and impedance matching, and a semiconductor package having a semiconductor chip mounted on the wiring board. The wiring board includes a substrate body made of an inorganic material, a flat plate-like first electrode penetrating the substrate body in the thickness direction, and a flat plate-like second electrode penetrating the substrate body in the thickness direction. An electrode, the first electrode and the second electrode are opposed to each other with a predetermined interval, and the substrate body is disposed in the thickness direction between the first electrode and the second electrode. A signal electrode penetrating the first electrode and the second electrode is provided, and one of the first electrode and the second electrode is a ground electrode, and the other is a power electrode. [Selection] Figure 11 |