| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81911
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81912
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81193
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3675
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16237 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49833 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50 |
| filingDate |
2020-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6737245b79706f42f20bf35c0f8b5529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e679c0583a7273ec2367de01d077460
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_732afdd2f07a868d6b973d2009bb1a43 |
| publicationDate |
2021-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-112447530-A |
| titleOfInvention |
Chip package structure and method of forming the same |
| abstract |
A chip package structure and a method of forming the same are provided. The method includes providing a wiring substrate. The method includes sequentially forming a nickel-containing layer and a gold-containing layer over the first pad. The method includes forming a conductive protective layer overlying the gold-containing layer over the nickel-containing layer. The method includes bonding a chip to a wiring substrate via a conductive bump and a flux layer surrounding the conductive bump. The conductive bump is between the second pad and the chip. The method includes removing the flux layer while the conductive protective layer covers the nickel-containing layer. |
| priorityDate |
2019-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |