http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8716858-B2

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ac3f4ae633f03dad0071a6c7724730f7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a43abee18f41a21ad1bebddc4ce13fb9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4c7041e69d917f73cd4955b969c8ccbe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1ec8375ee099b693cb3d13ae1c9a9280
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81416
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05571
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15788
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13139
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05664
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81411
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05583
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05609
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81439
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81413
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81447
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81455
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
filingDate 2011-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c17c24fb70c61c54cc9326ae1353ff2f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52b239066510f6abf5e4f79c5e34b847
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19fa7da57289e1e9dca072b04a5e0376
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b77cdec076d68d849f5ec61f7a27cecd
publicationDate 2014-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8716858-B2
titleOfInvention Bump structure with barrier layer on post-passivation interconnect
abstract A semiconductor device includes a barrier layer between a solder bump and a post-passivation interconnect (PPI) layer. The barrier layer is formed of at least one of an electroless nickel (Ni) layer, an electroless palladium (Pd) layer or an immersion gold (Au) layer.
priorityDate 2011-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011049705-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7724359-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008138624-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5466635-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7391112-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010090318-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H05335313-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007232051-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6578754-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009115058-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006292851-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010041234-A1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412550040
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID77987
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23938
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419558592
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425270609
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID935
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129581052
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667

Total number of triples: 85.