| abstract |
The semiconductor device includes a conductive pad disposed on a substrate and a connection terminal electrically connected to the conductive pad, wherein the connection terminal includes a lower pillar layer, a diffusion barrier layer, and an upper pillar layer sequentially stacked. a conductive pillar structure having a protrusion on a sidewall thereof, and a solder layer disposed on the upper pillar layer and in contact with at least a portion of the protrusion. |