| abstract |
A semiconductor package (10) is composed of a circuit board (11), a semiconductor device (12) mounted on the circuit board, and the like. The circuit board (11) and the semiconductor device (12) are electrically connected by a removable connecting mechanism. The connecting mechanism is composed of a device side terminal (21) as an external connecting terminal provided at a bottom part of the semiconductor device (12), and an electrode (26) as an external connecting terminal provided on the circuit board (11). The device side terminal (21) is composed of a base body (22) made of a metal material forming a protrusion, and carbon nanotubes (23) extending substantially vertical to a surface of the base body (22) with their base parts firmly fixed on the base body (22) through a base layer (24), and the leading edges of the carbon nanotubes (23) are brought into contact with a side wall plane (26b) of a recessed part of the electrode (26). The device side terminal (21) and the electrode (26) are electrically connected and are mechanically coupled through the carbon nanotubes (23). |