patent/US-2013093079-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013093079-A1

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filingDate	2011-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c54438db67063b607bc1ccf8a7d9ec3a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4b957cdeb5fba6692bb2561aaebbd24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d871f0c287e5ad34605d1482c220a2d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4658841af89f2cb435fcdf173d07f70 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca5879c84efc15a7fe41feb5ceb5fb7f
publicationDate	2013-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2013093079-A1
titleOfInvention	Connector Structures of Integrated Circuits
abstract	A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad.
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Incoming Links

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Total number of triples: 137.