| abstract |
In a method of contacting a chip, first contact elevations (104) are deposited on contact electrodes (102) of the chip (100), a first flexible circuit support (114) is provided on the chip, the flexible circuit support (114) having recesses (120, 120') which are aligned with the contact elevations (104), and second contact elevations (124) are deposited on the first contact elevations (104) in such a way that the contact regions (118) on the first flexible circuit support (114) are in contact with the first and/or second contact elevations (104, 124). |