| abstract |
A packaging structure includes a semiconductor chip and conductive connection pillars. Each of the conductive connection pillars has a first surface and a second surface opposite to the first surface, and the first surfaces of the conductive connection pillars are fixed to a surface of the semiconductor chip. The packaging structure also includes a carrier plate. The carrier plate is disposed opposite to the semiconductor chip. The conductive connection pillars are located between the semiconductor chip and the carrier plate, and the second surfaces face the carrier plate. The packaging structure further includes solder layers located between the carrier plate and the second surfaces, and a barrier layer located on the surface of the carrier plate around the solder layers. |