patent/US-6365501-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6365501-B2

Outgoing Links

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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485
filingDate	2001-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2002-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0c12d70ad57eca0bf502379fe73edd5
publicationDate	2002-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-6365501-B2
titleOfInvention	Mask repattern process
abstract	The present invention relates to an improved method for forming a UBM pad and solder bump connection for a flip-chip which eliminates at least two mask steps required in standard UBM pad forming processes when repatterning the bond pad locations.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6921980-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002086513-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6555460-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003096495-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6815327-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6539624-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7220657-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005005436-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6750548-B2
priorityDate	1996-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8454 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID127464134

Total number of triples: 73.