| abstract |
The present invention relates to a semiconductor device package that can be packaged with high reliability without using a flux when mounting the semiconductor device on a substrate, and a packaging method thereof. The semiconductor device package according to the present invention includes a semiconductor device and the semiconductor device. A substrate disposed opposite to the device, and a plurality of protrusions surrounding a peripheral portion of the accommodation region where the semiconductor element is disposed are provided on a facing surface of the substrate facing the semiconductor device. And The semiconductor device packaging method according to the present invention includes a step of preparing a semiconductor device, a step of preparing a substrate, and a projecting object on the substrate so as to surround a peripheral portion of a receiving region where the semiconductor device is disposed on the substrate. Forming the semiconductor element, dropping the semiconductor element into an accommodation area inside the protrusion, and mounting the semiconductor element on the substrate while placing the substrate on which the semiconductor element is placed in a chamber and exposing the semiconductor element to formic acid gas. A stage. [Selection] Figure 4 |