| abstract |
DISCLOSURE OF THE INVENTION An object of the present invention is to provide a semiconductor device and a method of manufacturing the same, a stacked semiconductor device, a circuit board, and an electronic device, which can easily and easily achieve electrical connection between stacked semiconductor elements with high reliability. To provide.n n n A method of manufacturing a semiconductor device includes a first step of forming a through hole 4 in a semiconductor element 6 having a plurality of electrodes 2 on a first surface, and electrically connected to the electrode 2, And a second step of forming the conductive layer 8 so as to reach from the inner wall face of 4) on the first face and on the second face opposite to the first face, and in the second step, on the first face and the second face. In order to provide the connection part 14, the space | interval of the at least 2 electrode 2 among the some electrode 2 differs from the space | interval of at least one of the connection part 14 of a 1st surface and a 2nd surface. The conductive layer 8 is formed. |