| abstract |
An object of the present invention is to prevent disconnection of wiring and to prevent peeling of a protective film on a substrate.n n n The wiring board 10 is provided on the wiring 20 which consists of the land 22 and the line 28 connected to the land 22, the board | substrate 12 which supports the wiring 20, and the board | substrate 12, A protective film 40 having an opening 42, and the land 22 is a portion including a connection portion 26 with the line 28, and includes a first portion 23 covered with the protective film 40. And a second portion 24 exposed from the opening 42, and a hole 30 exposing the substrate 12 in at least the first portion 23 of the land 22. |