| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05571
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81903
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0781
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83851
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29499
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-325
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05573 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-10 |
| filingDate |
1999-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2001-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2826ec5be3bba051cd2bb097eb6c2208
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4fa301e56cc6ed04e9aea423eb191d6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5018af03823e7e0d0a8c8f31fc32cfbc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a5afd1a4ef5a5fd64b1a16c9b229de6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2e253a340a676d119d8d6bbebcaded9 |
| publicationDate |
2001-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-462095-B |
| titleOfInvention |
Semiconductor device and its manufacturing method |
| abstract |
A memory card is able to surely perform positioning between a memory chip 1 and a card substrate 2 in bonding flip chip. The memory card comprises a semiconductor chip 1 having plural electrodes 1b on its major surface 1a; a card substrate 2 having a wiring section 2b electrically connected to the electrodes 1b of the semiconductor chip 1, an insulating layer 2c formed around the wiring section 2b, and a recessed section 2f which is made in a connection surface 2e of the wiring section 2b and of which the height from an mounting surface 2d is lower than the insulating layer 2c; a gold bump 4 positioned by the recessed section and interposed between the electrodes 1b of the semiconductor chip 1 and the wiring section 2b of the card substrate 2 through the positioning of the recessed section 2f of the wiring section 2b lower than the insulating layer 2c; and an ACF3 for ensuring the connection between the gold bump 4 and the wiring section 2b. With the recessed section 2f and insulating layer 2c of the wiring section 2b, it is able to surely perform positioning between the gold bump 4 and wiring section 2b in bonding flip chip. |
| priorityDate |
1999-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |