patent/US-5869904-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5869904-A

Outgoing Links

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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-60
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filingDate	1998-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	1999-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a96cab733dcbdd738262519d08331ade
publicationDate	1999-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-5869904-A
titleOfInvention	Semiconductor device having a projecting electrode
abstract	A semiconductor device comprises a plurality of solder bumps each formed on a pad of a semiconductor device. The top of each of the solder bumps is covered with a masking film, and the bases of the solder bumps are buried with a reinforcement film. The oxidation of the solder bumps is prevented by the masking film and the reinforcement film, the latter also undertaking the thermal stress generated between the semiconductor chip and the circuit board. The mounting is conducted with the masking film remaining on the top of the solder ball, which breaks the masking film and connected to the pad on the circuit board.
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priorityDate	1997-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 155.