| abstract |
A compression cold welding method, a joint structure, and an airtight sealing safety containment device are provided. The method includes providing a first substrate having at least one first bonding structure wherein the surface comprises a first bonding surface comprising a first metal; Providing a second substrate having at least one second bonding structure wherein the surface comprises a second bonding surface comprising a second metal; The at least one first bond structure and the at least one agent to locally deform and shear the bond surfaces at one or more interfaces in an amount effective to form an intermetallic bond between the first metal and the second metal of the bond surface. Compressing the two bond structures with each other. Overlaps of the bonding surfaces are effective in displacing surface contaminants and facilitating intrinsic contact between the bonding surfaces without the input of heat. Hermetically sealed devices include drug formulations, biosensors, or MEMS devices.n n n n Airtight, Sealed, Pharmaceutical Formulations, Biosensors, Implants, Intermetallic Bonding, Bonding, Bonding |