http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005150382-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fe3c91f54b5a7c6b47e19d1259a241fc |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16237 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2003-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b38ac4fea24a1e4d9011cb47d9af9a18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80ec9af3c51f7c471cb94026c15fd8cc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f83236f0db590805994102648cf3d6ca |
| publicationDate | 2005-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2005150382-A |
| titleOfInvention | Ribbon for ball bump formation, method for manufacturing the same, method for forming ball bump, and method for manufacturing semiconductor device using the same |
| abstract | PROBLEM TO BE SOLVED: To provide a ball bump forming ribbon capable of reducing a variation in a thin wire break length remaining immediately above a bump electrode, a manufacturing method thereof, a method of forming a ball bump, and a multi-pin, thin and fine structure using the bump. A method for manufacturing a possible semiconductor device is provided. A ratio of a length of a long side to a length of a short side in a cut surface in a direction orthogonal to the longitudinal direction is 0.09 ≦ (length of short side) / (length of long side) ≦ 0.8. A ribbon 8 for forming a ball bump, which is characterized in that A ball 9 is formed by thermal energy at the tip of the thin wire inserted into the capillary 7 and the capillary is lowered to press-bond the ball onto the IC chip electrode 3 or the external wiring, and then the fine wire is pulled upward to In the ball bump forming method of separating the pressed ball 9 and the fine line by supplying the ball part onto the IC chip electrode or the external wiring and arranging a large number of the ball parts by the same means, The ribbon 8 is used. [Selection] Figure 1 |
| priorityDate | 2003-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.